The substrate heating test system using a high-precision flying probe tester
Thermal stress tests are performed on substrate.
However, during post-cooling inspections, defects that manifest only at high temperatures may go undetected at room temperature when the expanded board returns to its original state.
The FA1813 Flying Probe Tester offers an integrated heating system that allows low-resistance measurements while simultaneously heating the substrate custom-ordered according to your requirements.
FA1813 is widely used for testing high-end substrate ,because it enables precise 4-terminal measurements with a minimum pad diameter starting from 28um.