Industries Electronic Components

Electrification of automobiles and more advanced functionality for mobile handsets are driving up component counts, demanding ever-higher productivity. HIOKI's high-speed, high-precision measurement solutions help our customers achieve reliable characterization in development, streamline compliance testing, and accelerate production inspection — supporting electronic component manufacturing across its entire lifecycle.

Case study

• 
  Measuring the impedance of piezoelectric ceramics more quickly, accurately, and easily

  Realizing a testing system that can accommodate increases in production volume with an impedance measurement time of 0.5 ms per point

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Related Products

Applications

Component Characterization & Material Analysis

MLCCs / PIN diodes / Photodiodes / Insulation materials / Flat enameled wire
For engineers in the development and design phase who need to accurately assess the electrical properties of components and materials

• Measurement of DC Voltage Bias Characteristics in Multilayer Ceramic Capacitors (MLCCs)
• Measuring the high-frequency forward resistance of PIN diodes
• Simple Measurement of Semiconductor and Diode C-V Characteristics
• Use of the SM7110 to Evaluate I-V Characteristics of Photodiodes in Optical Communications
• Surface and Volume Resistivity Measurement of Insulation Materials
• Testing of Dielectric Constant and Dielectric Loss Tangent Temperature Characteristics in Electrical Insulating Materials
• Temperature Correction Using a Radiant Temperature Sensor for Measurement of the Resistance of Flat Enameled Wire

Reliability Testing & Standards Compliance

Automotive components (AEC-Q200) / Insulation materials
For engineers in the evaluation and certification phase who need to efficiently meet automotive standards and safety requirements

• AEC-Q200-compliant evaluation of the temperature of electronic components
• Insulation Performance Testing of Insulating Materials: An Essential Process for Electric Vehicles

Production Inspection: Speed & Automation

Chip resistors / PCBs / Solder joints / Probe cards / IC test sockets / Burn-in boards / Connectors & harnesses / RF modules
For engineers in the mass production phase who need to increase inspection throughput and enable early defect detection

• Overcoming Efficiency Challenges in Chip Resistor Voltage Stress Testing Processes
• AI analyzes the board inspection data of the flying checker and detects latent defects that are difficult to find
• Weld Quality Inspection by Resistance Measurement
• Probe Card and IC Test Socket Testing System
• Burn-in Board Testing System
• Connector and Harness Testing System
• RF Module Testing System