FLYING PROBE TESTER FA1813
Flagship model for package board testing
Upper arm board alignment uses a high-resolution camera with twice the pixels as the previous model and a high-magnification lens (with 2× optical zoom) to help achieve accurate probing of the fine-pitch pads found on high-density package boards.
“Probe-down with contact check,” a new function, facilitates optimal probe stroke to minimize impact marks, reducing damage to pads.
Key Features
- Four-terminal measurement of fine-pitch pads
- Reduced impact marking when used with the latest probes
- Defect analysis using Process Analyzer
Model No. (Order Code)
FA1813 |
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Specifications Overview
Number of arms | 4 (2 each, top and bottom) | |
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Mountable probes | 1172 series, 1072 series, 1073 series | |
Number of test steps | Max. 999,999 steps | |
Measurement parameters and measurement ranges | ||
Resistance : | 40.00 μΩ to 100.0 MΩ | |
Constant DC current continuity measurement |
400.0 m Ω to 1.000 k Ω | |
Constant DC current resistance value measurement |
40.00 μ Ω to 400.0 K Ω | |
Constant DC voltage resistance value measurement |
4.000 Ω to 40.00 M Ω | |
Insulation resistance : | 1.000 kΩ to 100.0 GΩ | |
Capacitance : | 100.0 fF to 10.00 μF | |
Leak current measurement : | 100.0 μA to 10.00 mA | |
High voltage resistance : | 1.000 kΩ to 100.0 GΩ | |
Capacitance Insulation resistance : | 1.000 kΩ to 10.00 MΩ | |
Open test : | 4.000 Ω to 4.000 MΩ | |
Short test : | 400.0 mΩ to 40.00 kΩ | |
LSI Connection test | 0.000 V to 12.00 V | |
Measuring resistance | 10.00 Ω to 100.0 k Ω | |
Measuring capacitance (For parts inspection) |
10.00 p F to 100.0 μ F | |
Inductance : | 1.000 μH to 1.000 mH | |
Judgment range | -99.9% to +999.9% or absolute value | |
Minimum resolution of XY movement | 0.1 μm/pulse | |
Minimum resolution of Z movement | 1 μm/pulse | |
Minimum pad pitch | Top surface: 32 um (with CP1075-09) Bottom surface: 44 um (with CP1075-09) |
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Minimum pad size | Top surface: 2 um (with CP1075-09) Bottom surface: 14 um (with CP1075-09) |
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Measurement speed | Max. 76 points/ s (X-Y movements of 0.15 mm, 4-arm simultaneous probing, when capacitance measurement) | |
Testable board size | Thickness : 0.5 mm (0.02 in) to 2.5 mm (0.10 in) Outer dimensions : 50 mm (1.97 in) W × 50 mm (1.97 in) D to 400 mm (15.75 in) W × 330 mm (12.99 in) D |
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Maximum testable area | 398 mm (15.67 in) W × 304 mm (11.97 in) D | |
Board clamping | Board 2-side chuck method (with tension function) | |
Power supply | 200 V, 220 V, 230 V, 240 V AC single-phase (specify at time of order), 50/60 Hz, 5 kVA | |
Dimensions and mass | 1355 mm (53.35 in) W × 1200 mm (47.25 in) H × 1265 mm (49.81 in) D, (Excluding protruding parts), 1,130 kg (39859.6 oz) |
Software (3)
OFF-LINE SOFTWARE E4310