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| X-Y type: Product features |
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These high-speed, high-precision, high-reliability populated board flying probe testers are ideal for high-mix low volume production. Four-Wire measurement function enables detection of lifted leads of ICs as well as catching the dry joints.
The capabilities extend to the active in-circuit test of FETs, relays, and 3-terminal voltage regulators--applications so far regarded as challenging test issues for conventional equipment. Optional features even allows to conduct simple functional measurement, boundary scan, and crystal oscillator frequency counting, etc.
An X-Y ICT platform designed while keeping flexibility and future expandability in mind! |
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| X-Y IN-CIRCUIT HiTESTERs 1240 Series |
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Ideal for qualifying IC lead solder welding condition and dry joint detection
| 1240-01: |
High-speed testing of large boards (0.025 seconds/step) |
| 1240-02: |
Ideal for testing for poor IC lead contact (1114 successor model) |
| 1240-03: |
High-speed testing of mid-size boards (0.025 seconds/step) |
- Detection of IC lifted-legs and dry joints
- High-speed testing at 0.025 seconds/step (1240-01/03 with 2.5 mm movements)
- Data protected at different security levels
- Test Data fully compatible with earlier models in the series
- Selectable optimized probing paths calculated after component heights of a given board is taken into account..
- Large size Board: Test Area up to 510 × 460 mm (1240-01/02)
- Mid size Board: Test Area up to 400 × 330 mm (1240-03)
- Optional Active Test feature allow functional testing of FETs, Relay operation, and 3-terminal Voltage Regulators
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| HIOKI Expert |
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| Easily create high quality high precision test data files in a short time! EXPERT enhance your test efficiency. |
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Zero days spent on program creation after component mounting!
In recent years, as the industry have developed technologies for high density interconnect boards and miniaturization of electronic components, greater challenges to test engineers emerged in sustaining the test quality to ensure the product quality.
Our ICT (in-circuit testers) capable of detecting IC dry-joints and thus fulfill the essential test for highly denser, high quality and reliability electronic products.
However, to setup a running ICT program quickly, it is necessary to go through the "CAD-to-Test" programming process in a short time:
HIOKI Expert realize very high programming efficiency for CAD-to-Test process resulting in high precision as well as high quality test data in a short time.
The use of HIOKI Expert software improves test quality. |
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■ Test data creation
HIOKI EXPERT |
■ Test execution
HIOKI X-Y in-circuit tester |
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- Expert lets you create data for HIOKI testing systems by acquiring data from most common CAD applications in the industry.
- Expert also support HIOKI's unique capability: the dry-joint check function
- The data process time can be shorten to a few hours by using CAD data for a board that would have taken several days to create by conventional methods!
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- The advanced features including capability of detecting IC dry-joints enjoy wide acceptance in the highly density, high quality and reliability electronic products manufacturing industry.
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| Data creation workflow |
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| Time required to create test data ranges from less than an hour to several hours. |
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(1) Acquisition of ASCII CAD and BOM data
(2) Automatic selection of probing points
(3) Output of test program (COS/COP)
(4) Transfer data to ICT |
Testers applicable with HIOKI Expert (COS/COP)
◈ 1111 IN-CIRCUIT HiTESTER
◈ 1112 IN-CIRCUIT HiTESTER
◈ 1114 IN-CIRCUIT HiTESTER
◈ 1240 IN-CIRCUIT HiTESTER |
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| HIOKI Expert functionality |
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- Board Design ASCII CAD Data Import
Just by importing ASCII data from more than 45 CAD applications, pad sizes, component shapes, drills, and inner outer layer pattern layouts can easily be displayed graphically.
- Probing Point Batch Offset feature ensure high-precision test data generation
This batch offset feature allow us to easily shift a bunch of probing points toward new locations following a given rule based on the centers of pads.
- From CAD import to test data generation, all process steps are automated.
By direct importing PCB design CAD/ASCII and automated generation of test programs and schematics, production lead time is shorted, reduce costs, and improve quality.
- Less test data preparation work by utilizing CAD data
Utilization of PCB design CAD data enables dramatic reduction of work load compared to the time conventionally required for processing Gerber data, circuit schematics, net lists, and many others! Resulting in much shorter lead time for data generation. |
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