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| Integrated flying probe/press type testers: Product features |
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Integrated flying probe/press type testers are hybrid systems that use X-Y testing for the topside and a fixed test fixture for the bottom-side of the target board. They are designed for use in medium-volume production environments.
These system are ideal for high-speed testing of high-density, multilayer boards such FL-BGA, MCM, and LTCC. |
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| X-Y INTEGRATED HiTESTER 1118 |
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Combination of flying probe and bed-of-nails testing
Super-high-speed testing at up to 100 steps/second
| 1118-02: |
Double shuttle transport for package use; board size: 70 (W) × 250 (D) mm |
| 1118-12: |
Single shuttle transport for package use; board size: 200 (W) × 250 (D) mm |
- Batch isolation and continuity testing of the BGA side with a test-head
- High-precision testing of the C4 side with flying probes
- High-precision low-resistance IVH measurement using 4-terminal measurement
- Isolation testing at 1 to 250 V DC
- Micro-short detection function
- High-speed capacitance testing at a resolution of 5 aF (1 aF = 10-18F)
- High-resistance short detection using capacitance measurement
- Step & Repeat support for array boards
- No-idle during transport time by employing dual test-head design (1118-02)
- Universal test-head support
- Up to 8,192 pins (test fixture)
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